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Bionnections addresses the main challenges that will confront the semiconductor industry as the density of chips continues to grow and feature size continues to shrink. As the feature size approaches 22nm, fundamental physical limitations will emerge making the existing top-down approaches to semiconductor manufacturing challenging and costly. Bionnections' technology is introducing a new type of conducting nano-wires, having improved characteristics with respect to heat dissipation and durability to electromigration failure, yet being easily positioned at pre-programmed locations through a unique patent-pending self-assembly scheme.
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